软硬结合板

层数/Layers：Rigid-fiexbile,4layers

板厚Thickness: 1.6mm

最小孔径Min.Hole Size: 0.1mm

线宽线距/Width/Space：4.0/4.0mil

表面处理/Surface Treatment:ENIG

特殊工艺/Special Process：Rigid-fiexbile

应用领域/Appilcation: Industrial sentor