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HDI
层数/Layers HDI:8Layers 1+6+1,FR4
板厚Thickness: 1.6mm
最小孔径Min.Hole Size: 0.1mm
线宽线距/Width/Space:4.0/3.0mil
表面处理/Surface Treatment:ENIG
特殊工艺/Special Process:(1+6+1)
应用领域/Appilcation:Digital
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HDI
层数/Layers HDI:6Layers 1+4+1,FR4
板厚Thickness: 1.0mm
最小孔径Min.Hole Size: 0.2mm
线宽线距/Width/Space:3.0/3.0mil
表面处理/Surface Treatment:ENIG+OSP
特殊工艺/Special Process:ENIG+OSP on the same layer
应用领域/Appilcation:Mobile
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HDI
层数/Layers HDI:1+2+1,FR4
板厚Thickness: 1.0mm
最小孔径Min.Hole Size: 0.15mm
线宽线距/Width/Space:3.0/3.0mil
表面处理/Surface Treatment:ENIG
特殊工艺/Special Process:0.15mimhole in the BGA pad
应用领域/Appilcation:Security syetem
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HDI
层数/Layers HDI:1+1+4+1+1,FR4
板厚Thickness: 1.6mm
最小孔径Min.Hole Size: 0.1mm
线宽线距/Width/Space:4.0/3.0mil
表面处理/Surface Treatment:ENIG
特殊工艺/Special Process:2Step HDI
应用领域/Appilcation:POS