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Address:Shenzhen Baoan 42 District of 

               CRE modern service industry

               Garden E building 6 floor

Postal code:518034

Telephone:0755-26414680

Fax:26067734    



High Density Interconnector
Location:Home/Product/High Density Interconnector

层数/Layers HDI:1+1+4+1+1,FR4

板厚Thickness: 1.6mm

最小孔径Min.Hole Size: 0.1mm

线宽线距/Width/Space:4.0/3.0mil

表面处理/Surface Treatment:ENIG

特殊工艺/Special Process:2Step HDI

应用领域/Appilcation:POS



Electronic design continues to improve the performance of the machine, while also trying to reduce its size. From mobile phones to smart weapons, small portable products, "small" is always the same pursuit. High-density integration (HDI) technology can make the end product design more compact, while meeting the electronic performance and efficiency of higher standards. HDI is widely used in mobile phones, digital cameras, MP3, MP4, notebook computers, automotive electronics and other digital products, among which the most widely used mobile phones. HDI board generally used to build-up (Build-up) manufacturing, the more the number of layers, the higher the technical grade plate. Ordinary HDI board is basically a laminated, high-level HDI with 2 or more layers of technology, while using stacked holes, electroplating fill, laser drilling and other advanced direct PCB technology. High-end HDI board is mainly used in 3G mobile phones, advanced digital cameras, IC board and so on.