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层数/Layers:2Layers FR4
板厚Thickness: 0.8mm
最小孔径Min.Hole Size: 0.2mm
线宽线距/Width/Space:3.0/3.0mil
表面处理/Surface Treatment: Plating Gold
特殊工艺/Special Process:Gold film
应用领域/Appilcation:Digital
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层数/Layers:2Layers POGERS:RO4350B
板厚Thickness: 0.8mm
最小孔径Min.Hole Size: 0.3mm
线宽线距/Width/Space:8.0/5.0mil
表面处理/Surface Treatment:ENIG
特殊工艺/Special Process:Special Material
应用领域/Appilcation:High frequency
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层数/Layers:4Layers FR4
板厚Thickness: 1.6mm
最小孔径Min.Hole Size: 0.2mm
线宽线距/Width/Space:4.0/4.0mil
表面处理/Surface Treatment:V-CUT
特殊工艺/Special Process:Industrial sentor
应用领域/Appilcation:High frequency
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层数/Layers:6Layers FR4
板厚Thickness: 1.6mm
最小孔径Min.Hole Size: 0.15mm
线宽线距/Width/Space:4.0/4.0mil
表面处理/Surface Treatment:OSP
特殊工艺/Special Process:Hole tolerance+/-1.5mil width tolerance+/-1mil
应用领域/Appilcation:Industrial sentor
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层数/Layers:8Layers FR4
板厚Thickness: 2mm
最小孔径Min.Hole Size: 0.25mm
线宽线距/Width/Space:3.0/3.0mil
表面处理/Surface Treatment:ENIG
特殊工艺/Special Process:Special impedance
应用领域/Appilcation:Main board
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层数/Layers:8Layers FR4
板厚Thickness: 1.6mm
最小孔径Min.Hole Size: 0.2mm
线宽线距/Width/Space:4.0/5.0mil
表面处理/Surface Treatment:ENIG
特殊工艺/Special Process:Gold Finger
应用领域/Appilcation:Card board
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层数/Layers:10Layers FR4
板厚Thickness: 1.6mm
最小孔径Min.Hole Size: 0.2mm
线宽线距/Width/Space:4.0/4.0mil
表面处理/Surface Treatment:ENIG
特殊工艺/Special Process:Special impedance
应用领域/Appilcation:Telecom